Clearly viewing HBM as the logical future of high-performance RAM, Samsung has announced it has ramped up mass production on a HBM2 variant, codenamed Aquabolt, which now sits as the market's fastest 8GB HBM2 implementation at 2.4Gb/s per pin for a total of 307GB/s per package - almost double its first-generation HBM2 implementation, Flarebolt.
Unlike the first generation Samsung HBM2, codename Flarebolt, which peaked at 2.0Gbps, the new Samsung 8GB HBM2 chips, codenamed Aquabolt, operate at higher 2.4Gbps data rate per pin and are made with a new TSV design and thermal control technologies.
Samsung Electronics exceptionally labeled a brand name Aquabolt for the latest HBM2 DRAM chip. As for bandwidth, we're looking at around 300MBps per pin, which on a 1024-bit memory bus should provide around 307GB/sec per package, times 4 bringing us to a insane 1.2TB/sec of memory bandwidth. In the research department, Samsung says it'll continue to rapidly advance its memory technology in conjunction with leading OEMs throughout a range of fields including supercomputing, artificial intelligence, and graphics processing. The improvement equates to a overall transfer rate of 307GBps.
The company's 8GB Aquabolt HBM2 modules are produced using eight 8Gb dies connected via over 5,000 through-silicon vias (TSVs) per die, a number which Samsung notes can cause collateral clock skew avoided through an as-yet unspecified design tweak.
Samsung also added more thermal bumps between the HBM2 dies, something that will help with heat dissipation and it also doubles as a protective layer at the bottom of the HBM2 stack.
Samsung didn't say when it would be supplying the new memory to partners although if it's already in mass production, one can hope that partner availability won't be too far out.